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| SEMICONDUCTOR TECHNICAL DATA General Description This planar stripe MOSFET has better characteristics, such as fast switching time, fast reverse recovery time, low on resistance, low gate charge and excellent avalanche characteristics. It is mainly suitable for electronic ballast and switching mode power supplies. FEATURES VDSS= 500V, ID= 5.0A Drain-Source ON Resistance : RDS(ON)=1.4 Qg(typ) = 12nC trr(typ) = 150ns D KF5N50PR/FR/PS/FS N CHANNEL MOS FIELD EFFECT TRANSISTOR KF5N50PR, KF5N50PS A O C F E G B Q I K P M L J N N H @VGS = 10V MAXIMUM RATING (Tc=25 ) RATING DIM MILLIMETERS _ 9.9 + 0.2 A 15.95 MAX B 1.3+0.1/-0.05 C _ D 0.8 + 0.1 _ E 3.6 + 0.2 _ F 2.8 + 0.1 3.7 G H 0.5+0.1/-0.05 1.5 I _ 13.08 + 0.3 J K 1.46 _ 1.4 + 0.1 L _ 1.27+ 0.1 M _ 2.54 + 0.2 N _ 4.5 + 0.2 O _ 2.4 + 0.2 P _ 9.2 + 0.2 Q CHARACTERISTIC SYMBOL VDSS VGSS ID IDP EAS EAR dv/dt PD Tj Tstg KF5N50PR KF5N50PS 500 KF5N50FR KF5N50FS UNIT 1 2 3 1. GATE 2. DRAIN 3. SOURCE Drain-Source Voltage Gate-Source Voltage @TC=25 Drain Current @TC=100 Pulsed (Note1) Single Pulsed Avalanche Energy (Note 2) Repetitive Avalanche Energy (Note 1) Peak Diode Recovery dv/dt (Note 3) Drain Power Dissipation Tc=25 Derate above 25 V V 5.0* 2.9* 13* A S E G B F 30 5.0 2.9 13 270 8.6 20 83 0.66 150 -55 150 41.5 0.33 TO-220AB A KF5N50FR, KF5N50FS C mJ mJ V/ns W W/ P DIM MILLIMETERS K L L R Maximum Junction Temperature Storage Temperature Range Thermal Characteristics Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-toAmbient M D D J N N H RthJC RthJA 1.5 62.5 3.0 62.5 /W 1 2 3 Q /W A B C D E F G H J K L M N P Q R S _ 10.0 + 0.3 _ 15.0 + 0.3 _ 2.70 + 0.3 0.76+0.09/-0.05 _ 3.2 +0.2 _ 3.0 + 0.3 _ 12.0 + 0.3 0.5+0.1/-0.05 _ 13.6 + 0.5 _ 3.7 + 0.2 1.2+0.25/-0.1 1.5+0.25/-0.1 _ 2.54 +0.1 _ 6.8 + 0.1 _ 4.5 + 0.2 _ 2.6 + 0.2 0.5 Typ * : Drain current limited by maximum junction temperature. 1. GATE 2. DRAIN 3. SOURCE PIN CONNECTION (KF5N50PR, KF5N50FR) D TO-220IS (KF5N50PS, KF5N50FS) D G S G S 2008. 10. 10 Revision No : 0 1/7 KF5N50PR/FR/PS/FS ELECTRICAL CHARACTERISTICS (Tc=25 CHARACTERISTIC ) TEST CONDITION MIN. TYP. MAX. UNIT SYMBOL Static Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Drain Cut-off Current Gate Threshold Voltage Gate Leakage Current Drain-Source ON Resistance BVDSS BVDSS/ Tj IDSS Vth IGSS RDS(ON) ID=250 , VGS=0V 500 2.0 0.55 1.15 10 4.0 100 10 1.4 V nA V V/ ID=250 , Referenced to 25 VDS=500V, VGS=0V, VDS=VGS, ID=250 KF5N50PR/FR KF5N50PS/FS VGS= 30V, VDS=0V VGS= 25V, VDS=0V VGS=10V, ID=2.5A Dynamic Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-on Delay time Turn-on Rise time Turn-off Delay time Turn-off Fall time Input Capacitance Output Capacitance Reverse Transfer Capacitance Source-Drain Diode Ratings Continuous Source Current Pulsed Source Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge IS ISP VSD trr Qrr VGS Note 5) Essentially independent of operating temperature. Marking 1 1 1 KF5N50 801 PR 2 KF5N50 813 FR 1 2 KF5N50 801 PS 2 KF5N50 813 FS 2 1 PRODUCT NAME 2 LOT NO 2008. 10. 10 Revision No : 0 27 KF5N50PR/FR/PS/FS Fig1. ID - VDS 100 VDS=30V Fig2. ID - VGS Drain Current ID (A) Drain Current ID (A) VGS=10V 10 1 10 VGS=7V TC=100 C 1 VGS=5V 10 0 25 C 0.1 0.1 1 10 100 10 -1 2 4 6 8 10 Drain - Source Voltage VDS (V) Gate - Source Voltage VGS (V) Fig3. BVDSS - Tj Normalized Breakdown Voltage BVDSS 1.2 VGS = 0V IDS = 250 Fig4. RDS(ON) - ID 3.0 On - Resistance RDS(ON) () 2.5 VGS=6V 1.1 2.0 1.5 VGS=10V 1.0 1.0 0.5 0 0 0.9 0.8 -100 -50 0 50 100 150 2 4 6 8 10 12 Junction Temperature Tj ( C ) Drain Current ID (A) Fig5. IS - VSD 10 2 Fig6. RDS(ON) - Tj 3.0 VGS =10V IDS = 2.5A Reverse Drain Current IS (A) Normalized On Resistance 2.5 2.0 1.5 1.0 0.5 10 1 TC=100 C 25 C 10 0 10 -1 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0.0 -100 -50 0 50 100 150 Source - Drain Voltage VSD (V) Junction Temperature Tj ( C) 2008. 10. 10 Revision No : 0 37 KF5N50PR/FR/PS/FS Fig 7. C - VDS 1000 12 ID=5A Fig8. Qg- VGS Gate - Source Voltage VGS (V) Ciss 10 8 6 4 2 0 0 2 4 6 8 10 12 14 16 VDS = 400V VDS = 250V VDS = 100V Capacitance (pF) 100 Coss 10 Crss 1 0 5 10 15 20 25 30 35 40 Drain - Source Voltage VDS (V) Gate - Charge Qg (nC) Fig9. Safe Operation Area 102 Operation in this Fig10. Safe Operation Area 102 Operation in this (KF5N50PR, KF5N50PS) (KF5N50FR, KF5N50FS) area is limited by RDS(ON) area is limited by RDS(ON) Drain Current ID (A) 101 Drain Current ID (A) 100s 1ms 101 100s 100 10ms 100ms 100 1ms 10ms 100ms 10-1 Tc= 25 C Tj = 150 C 2 Single pulse DC 10-1 Tc= 25 C Tj = 150 C 2 Single pulse DC 10 100 101 102 103 10 100 101 102 103 Drain - Source Voltage VDS (V) Drain - Source Voltage VDS (V) Fig11. ID - Tj 6 5 Drain Current ID (A) 4 3 2 1 0 0 25 50 75 100 125 150 Junction Temperature Tj ( C) 2008. 10. 10 Revision No : 0 47 KF5N50PR/FR/PS/FS Fig12. Transient Thermal Response Curve (KF5N50PR. KF5N50PS) 100 Duty=0.5 Transient Thermal Resistance 0.2 10-1 0.1 0.05 PDM t1 t2 gle Pu lse 0.02 0.0 1 Sin - Duty Factor, D= t1/t2 - RthJC = Tj(max) - Tc PD 100 101 10-2 10-5 10-4 10-3 10-2 10-1 TIME (sec) Fig13. Transient Thermal Response Curve (KF5N50FR. KF5N50FS) Duty=0.5 Transient Thermal Resistance 100 0.2 0.1 0.05 0.02 0.01 Sin gl u eP 10-1 PDM t1 lse t2 10-2 10-5 - Duty Factor, D= t1/t2 Tj(max) - Tc - RthJC = PD 10-4 10-3 10-2 10-1 100 101 TIME (sec) 2008. 10. 10 Revision No : 0 57 KF5N50PR/FR/PS/FS Fig14. Gate Charge VGS Fast Recovery Diode 10 V ID 0.8 VDSS 1.0 mA ID Q Qgs Qgd Qg VDS VGS Fig15. Single Pulsed Avalanche Energy EAS= 1 LIAS2 2 BVDSS BVDSS - VDD BVDSS L IAS 50V 25 VDS 10 V VGS ID(t) VDD VDS(t) Time tp Fig16. Resistive Load Switching VDS RL 90% 0.5 VDSS 25 VDS 10V VGS VGS 10% td(on) ton tr td(off) tf toff 2008. 10. 10 Revision No : 0 67 KF5N50PR/FR/PS/FS Fig17. Source - Drain Diode Reverse Recovery and dv /dt DUT IF Body Diode Forword Current VDS ISD (DUT) IRM di/dt IS Body Diode Reverse Current 0.5 VDSS driver VDS (DUT) Body Diode Recovery dv/dt VSD VDD 10V VGS Body Diode Forword Voltage drop 2008. 10. 10 Revision No : 0 77 |
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